WP 4

Development of robust contact layers


  • Develop and fabricate new contact layers with >200 % higher fracture energy, which will reduce ASR-degradation to <5 mΩcm² per 10 cycles
  • Demonstrate the feasibility to apply high-volume Drop-on-Demand (DoD) ink-jet printing to deposit contact layers

In this work package a novel robust contact solution is developed by:
• Optimizing the contact layer composition to obtain the best possible balance between high conductivity, improved mechanical stability and chemical compatibility with the interconnect coating.
• Evaluating the chemical and mechanical stability of the optimized contact layer in a simulated stack assembly and after 3000 h aging.
• Demonstrate the feasibility of using high-speed DoD printing to apply the contact layer on interconnects.

The reactive bonding concept is illustrated below. The contact layer is applied in it's metallic state, allowing it to adapt to the cell and interconnect shape under pressure. In-situ oxidation of the contact layer will form an electrically conductive spinel oxide, and generate a strong bond to both the interconnect coating and the oxygen electrode.

Reactive bonding concept


WP leader: Ragnar Kiebach (DTU)

18 APRIL 2021